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Applied Materials® Centura® HTF 2 Chamber RTP XE+ System
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| Make: |
Applied Materials® |
| Model: |
Centura® HTF |
| Bulletin Number: |
BO-176 |
| Vintage: |
2000 |
| Specification: |
Wafer Size: 200mm
Mainframe: TPCC
Chamber A: RTP-XE+ Toxic RP Process Chamber
Chamber B: RTP-XE+ Toxic RP Process Chamber
Chamber C: Blank
Chamber D: Blank
Chamber E: ENP Fast Cooldown Chambers
Chamber F: ENP Fast Cooldown Chambers
SACVD Gasbox, Four Door with Safety Glass
Single Line Drop
HP Robot
Narrow Body ENP load locks
Fast Wafer Mapping
Cassette Present Sensors
OTF
Expanded VME II
Gas Configuration
Chamber A MFC’s – Unit 8160
Gas line Purge: N2
Gas 1: O2, 10 slm
Gas 3: N2, 10 slm
Chamber B MFC’s – Unit 1660
Gas Line Purge: N2
Gas 1: O2, 10 slm
Gas 2: Ar, 10 slm
Gas 3: N2, 10 slm |
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© OEM Surplus, Inc.
Tel: 480-609-8565 Toll Free: (800) 686-4381
Applied Materials® is a trademark or registered trademark of Applied Materials, Inc. in the U.S. and other countries. Endura® is a trademark or registered trademark of Applied Materials, Inc. in the U.S. and other countries. Centura® is a trademark or registered trademark of Applied Materials, Inc. in the U.S. and other countries. Mattson® is a trademark or registered trademark of Mattson in the U.S. and other countries.
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