Dual frequency etch (DFE) module:
Dual frequency RF power supplies and matching network
Quartz shield for RF coupling
MFC for process Argon
Electropolished vacuum chamber
Dedicated 8 ultra high vacuum cryogenic pump
Dual-filament ion gauge

PVD Ti liner deposition module:
Quantum 200 planar DC magnetron sputtering source
Integrated arc-suppression kit
Twenty-four kilowatt (24KW), DC power source
Z-motion wafer heater stage
MFC for process Argon
Integrated heating jackets for chamber bake-out
Integrated lamp assembly for shielding bake-out
Integrated cooling in heater pedestal to reduce P.M. cycle time
Electropolished vacuum chamber
Dedicated 8 ultra high vacuum cryogenic pump
Dual-filament ion gauge

PVD Al-Alloy deposition module:
Quantum 200 planar DC magnetron sputtering source
Integrated arc-suppression kit
Twenty-four kilowatt (24KW), DC power source
Z-motion wafer heater stage
Integrated heating jackets for chamber bake-out
Integrated lamp assembly for shielding bake-out
Integrated cooling in heater pedestal to reduce P.M. cycle time
Electropolished vacuum chamber
Dedicated 8 ultra high vacuum cryogenic pump
Dual-filament ion gauge

PVD TiN anti-reflective coating (ARC) deposition module:
Quantum 200 planar DC magnetron sputtering source
Integrated arc-suppression kit
Twenty-four kilowatt (24KW), DC power source
Z-motion wafer heater stage
MFC for process Argon
Integrated heating jackets for chamber bake-out
Integrated lamp assembly for shielding bake-out
Integrated cooling in heater pedestal to reduce P.M. cycle time
Electropolished vacuum chamber
Dedicated 8 ultra high vacuum cryogenic pump
Dual-filament ion gauge

Wafer handling chamber:
Precision load arm
Automatic wafer centering and orientation
Four-point clamp degas station with dedicated cryogenic pump
Programmable wafer cooling station
Electropolished chambers
Dedicated 8 ultra high vacuum cryogenic pump
Dual-filament ion gauge

Transfer Module:
Five (5) process module ports
Magnetically coupled dual-arm robot with Z-motion
Wafer position sensor at every hand-off location
Centralized distribution system for all utilities
Electropolished chamber
Dedicated 8 ultra high vacuum cryogenic pump
Dual filament ion gauge

System Controls, Power Distribution and Services:
Concept Two modular control architecture
Windows-based graphical user interface (GUI)
Main electronics rack for RF/DC power supplies
Single power-drop with built-in transformer and pump power interface
Single rack for cryogenic compressors

Dual Cassette Module:
Plastic cassette compatibility
Two load-locks, each with 8 ultra high vacuum cryogenic pump
Automatic door for cassette load-locks
Patented soft-vent load-lock for micro-contamination control
Automatic wafer/cassette mapping feature
AGV direct access compatibility
Electropolished chambers
Dual-filament ion gauges on each load lock
Pearl white painted front covers

System Options:
Ti target <Tosoh> for Q200 module, 5N, Qty. 2
Al Alloy target <Tosoh> for Q200 module, 5N, Qty. 1
Heat exchanger
Signal tower